Plasmatherm #2 - ta_nit1

in folder "recipe → gawlik → ta_nit.prc"

ta_nit1 Process

• CHF3 + O2 chemistry reference

• Process Gasses

  • CHF3: 40 sccm

  • O2: 10 sccm

• Pressure: 60 mTorr (limited by low vac diaphragm pump)

• RF power: 400 W

• Etch Rates

  • Si3N4: