AZ 1518 Photoresist recipe
David’s recipe (2 um target thickness):
Warm AZ1518 resist bottle to room temperature
AMI clean wafers at hood L10
(optional) HMDS oven prime - recipe #2
used when bonding to bare Si
Spin coat in hood L10
5 s @ 500 RPM; 100 RPM/s ramp
30 s @ 3500 RPM; 1000 RPM/s ramp
Remove edge bead with acetone on clean wipe
Soft bake
4 mins @ 115C
Exposure on Karl Suss MA8
172.5 mJ/cm2 (dosage equivalent for 22.5 s at 7.5 mW on MA6)
Post bake
30 s @ 115C
Development
~35s in AD-10
(optional) Hard bake
100 - 110C
To improve adhesion for wet etching applications