AZ 1518 Photoresist recipe

AZ 1518 Photoresist recipe

David’s recipe (2 um target thickness):

  1. Warm AZ1518 resist bottle to room temperature

  2. AMI clean wafers at hood L10

  3. (optional) HMDS oven prime - recipe #2

    1. used when bonding to bare Si

  4. Spin coat in hood L10

    1. 5 s @ 500 RPM; 100 RPM/s ramp

    2. 30 s @ 3500 RPM; 1000 RPM/s ramp

  5. Remove edge bead with acetone on clean wipe

  6. Soft bake

    1. 4 mins @ 115C

  7. Exposure on Karl Suss MA8

    1. 172.5 mJ/cm2 (dosage equivalent for 22.5 s at 7.5 mW on MA6)

  8. Post bake

    1. 30 s @ 115C

  9. Development

    1. ~35s in AD-10

  10. (optional) Hard bake

    1. 100 - 110C

      1. To improve adhesion for wet etching applications