AZ 1518 Photoresist recipe

David’s recipe (2 um target thickness):

Warm AZ1518 resist bottle to room temperature
AMI clean wafers at hood L10
(optional) HMDS oven prime - recipe #2
1. used when bonding to bare Si
Spin coat in hood L10
1. 5 s @ 500 RPM; 100 RPM/s ramp
2. 30 s @ 3500 RPM; 1000 RPM/s ramp
Remove edge bead with acetone on clean wipe
Soft bake
1. 4 mins @ 115C
Exposure on Karl Suss MA8
1. 172.5 mJ/cm2 (dosage equivalent for 22.5 s at 7.5 mW on MA6)
Post bake
1. 30 s @ 115C
Development
1. ~35s in AD-10
(optional) Hard bake
1. 100 - 110C
  1. To improve adhesion for wet etching applications