SU-8 Recipe

SU-8 3005 Datasheet:

KAM-SU-8-3000-Datasheet-7.10-final.pdf

David's Recipe - 10 um target with SU-8 3005

1. Warm SU8 to room temperature
2. AMI clean wafers at hood L10
3. March Asher - 4 min O2 plasma clean to remove organics
4. (optional) HMDS oven prime - recipe #2
   1. 10 min bake @180C to remove H2O
5. Spin Coat in hood L10
   1. 5 s @ 500 RPM; 100 RPM/s ramp
   2. 30 s @1000 RPM; 1000 RPM/s ramp
6. Remove edge bead with acetone on clean wipe
7. Soft bake
   1. 4 mins @ 95C
8. Exposure on Karl Sus MA8
   1. For full crosslinking: 172.5 mJ/cm2
   2. For partial cure: 50 or 85 mJ/cm2
9. Post Exposure Bake (PEB)
   1. 2 mins @ 95C (image should show after 1 min)
      1. This process finishes crosslinking that was initiated by UV exposure. If low crosslinking is desired, skip PEB or perform at low temperature (65C)
10. Development
    1. 4-6 mins with SU8 developer
       1. Requires relatively continuous agitation.
       2. If small hole features are being developed, sonication while developing may be required.
11. (optional) Hard bake
    1. 200C
       1. To realize maximum material properties. Shrinkage and cracking may occur. Refer to Keller et al. for PEB and soft bake process development or Natu et. al. for shrinkage during high temperature pyrolysis.