SU-8 Recipe
SU-8 3005 Datasheet:
David's Recipe - 10 um target with SU-8 3005
Warm SU8 to room temperature
AMI clean wafers at hood L10
March Asher - 4 min O2 plasma clean to remove organics
(optional) HMDS oven prime - recipe #2
10 min bake @180C to remove H2O
Spin Coat in hood L10
5 s @ 500 RPM; 100 RPM/s ramp
30 s @1000 RPM; 1000 RPM/s ramp
Remove edge bead with acetone on clean wipe
Soft bake
4 mins @ 95C
Exposure on Karl Sus MA8
For full crosslinking: 172.5 mJ/cm2
For partial cure: 50 or 85 mJ/cm2
Post Exposure Bake (PEB)
2 mins @ 95C (image should show after 1 min)
This process finishes crosslinking that was initiated by UV exposure. If low crosslinking is desired, skip PEB or perform at low temperature (65C)
Development
4-6 mins with SU8 developer
Requires relatively continuous agitation.
If small hole features are being developed, sonication while developing may be required.
(optional) Hard bake
200C
To realize maximum material properties. Shrinkage and cracking may occur. Refer to Keller et al. for PEB and soft bake process development or Natu et. al. for shrinkage during high temperature pyrolysis.