Plasmatherm #2

Nick's Notes:

David's Notes:

• Left chamber is for etching Si and Right is for etching SiO2 and Si3N4

• Chambers are left in vacuum. Must vent to load

  • utilities → select active → (select right/left)

  • **if vent is greyed out, press standby on bottom left, then go back to select vent**

    • **if this still doesn't work, press on, then standby**

• Cleaning

  1. wipe down stage and showerhead with water or IPA on a clean wipe

     • only wipe showerhead in one direction.

  2. Close chamber then pump down to low vac

     1. utilities → pump chamber → low vacuum

  3. O2 clean - should always perform O2 clean before using the tool and 5 min O2 clean after 45 min of use

     • process → load

       • select "o2 clean.prc" recipe in main recipe folder

• Running process

  • Find recipe in

• **if any problems arise, click "end step" until out of problem step, not abort **