Plasmatherm #2

Nick's Notes:

Left chamber is for etching Si and Right is for etching SiO2 and Si3N4
Chambers are left in vacuum. Must vent to load
- utilities → select active → (select right/left)
- **if vent is greyed out, press standby on bottom left, then go back to select vent**
  - **if this still doesn't work, press on, then standby**
Cleaning
1. wipe down stage and showerhead with water or IPA on a clean wipe
  - only wipe showerhead in one direction.
2. Close chamber then pump down to low vac
  1. utilities → pump chamber → low vacuum
3. O2 clean - should always perform O2 clean before using the tool and 5 min O2 clean after 45 min of use
  - process → load
    - select "o2 clean.prc" recipe in main recipe folder
Running process
- Find recipe in

**if any problems arise, click "end step" until out of problem step, not abort **