Masks on hand

Name	Description	Images	LEdit files	Submission Files
2010 TJ + TLM	Masks for metal and mesa etch for tunnel junctions and various tlm structures
2011 LASER	Masks for laser processing. Designed to allow both gain-guided and ridge-waveguide processes. For a single mask process, use the "ETCH" mask. For a dual mask process, use the "ETCH" mask followed by the "METAL" mask.
2013 LASER	Masks for laser processing. Designed to allow both gain-guided and ridge-waveguide processes. For a single mask process, use the "ETCH" mask. For a dual mask process, use the "ETCH" mask followed by the "METAL" mask. Differences from 2011 LASER are larger spacing between laser bars to ease separating them for epi-down mounting, added cavity length markers every 1/2 mm to ease cleaving to a desired cavity length, and changed to 50, 100, and 150 um wide laser bars. For smaller bar widths, use 2011 LASER.
March 2013 LASER	Adds a SiN mask, for ridge waveguide process.

To export to CIF for submission (in LEdit):

First create a new empty document
Instance you're master cell into it.
- Go to Cell >> Instance... Select the file at the top that contains the master design, select it and hit OK.
Go to Cell >> Flatten... This could take a bit of time and will result in all objects being directly inserted instead of instanced.
Add CIF names to the layers you used.
- Go to Setup >> Layers...
- Select a layer on the left, and enter a CIF name on the right, then hit OK.
Export to CIF
- Go to File >> Export Mask Data >> CIF...

Where to order photolithography masks from: