RIE Oxford

RIE Oxford

Oxford RIE Procedure

edited from what the MRC has posted (http://www.mrc.utexas.edu/index.php/nnin/processequipment/100). NTS, 03/27/2013

[Note: This is for etching Si family materials on III-V. Absolutely no metal allowed in system!]

[Note: Keep double doors closed – always 1 or 2 doors closed.]

Prep

  1. Log onto the tool using the LabAccess terminal.

  2. Log into the tool’s systems software by selecting SYSTEM and PASSWORD. Type your logon and password then select OK.

    1. If someone else failed to logout, select VERIFY then OK to log them out.

      1. @{$%(I think you can just log in over them, without pressing VERIFY, I will have to check)

  3. To verify you are logged into the tool, select SYSTEM then PASSWORD. Select OK.

  4. [Note: Pumping window should be standard open screen.]

  5. Stop/Vent the tool by selecting SYSTEM and PUMPING. Select STOP, wait, and then VENT.

    1. As you select the stop and vent buttons, they will highlight yellow.

  6. This tool is vented when a Warning!! Window pops up, which takes 3-8mins. Select ACCEPT.

  7. Open the chamber after ensuring the area around the chamber is clear. Open by turning the dial to CHAMBER UP and depressing both blue circular buttons.

  8. Inspect and clean the chamber. Wipe the stage wafer, quartz ring, and shell (if you can reach) with barely moistened kim-wipes, DI or IPA only.

    1. Communicate any issues to mertech@mer.utexas.edu.

    2. Ensure wafer pieces or debris is cleaned up.

    3. Visually inspect the stage wafer ensuring it does not need to be replaced. If it does, contact a staff member.

  9. Pull the black gloves out of the chamber area, ensuring the chamber shell is not blocked from closing.

  10. To close the chamber turn the dial to CHAMBER DOWN and depress both blue buttons until the chamber is closed. (You can tell it sad stories if you want).

  11. To Stop/Evacuate the tool, select SYSTEM and PUMPING. Select STOP, wait, and then EVACUATE.

  12. A window will pop up to log your run. Enter a label and select OK. As you select the stop and evacuate buttons, they will highlight yellow.

    1. @#$%{(You can leave the label blank)

  13. There will be a vacuum sealing noise when the chamber begins to evacuate. After two minutes, the Penning gauge value is < 1.0e-4 Torr and the process recipe can be selected.

  14. Wait til screen says base pressure reached.

  15. Select and run the clean recipe by selecting PROCESS then RECIPES. Select LOAD to scroll through the recipe list, select OXFORD O2 CLEAN.

    1. Verify the recipe is correct, left click on the clean step, select EDIT STEP. See the recipe logbook to verify the clean recipe. Recipes must contain three steps: a pumpdown step, main etch recipe step, and pumpdown step for optimum processing.

    2. Edit/change the time of the main etch step to desired time

    3. Select CHAMBER at the top left and deselect WAFER prior to running the recipe.

      1. @#$%{(We didn’t do that)

  16. Select RUN to begin processing. The screen will change as per Run Recipe and End Use Step 1. Don’t leave the tool til plasma strikes.

  17. When the run is complete, a green text “Ready” will appear on the process then chamber screen.

Load Sample and Setup Recipe

  1. Stop/vent the chamber to load your sample, refer to Prep Step 5.

  2. Load your sample:

    1. Place the sample into the clear pass-through. Only one pass-through door can be open at a time.

    2. Use plastic tweezers to place the sample in the center of the chamber surface. Secure the sample with kapton tape to avoid damaging the sample and chamber.

      1. (This substep was skipped altogether during training… normal tweezers should be OK…)@$%}

    3. Return the tweezers and tools to the pass-through. Ensure items are not in the way of the chamber closing.

  3. Stop/Evacuate the chamber, refer to Prep Step 11.

  4. Load the recipe needed for appropriate etching, refer to Prep Step 15. Select your recipe or create a new recipe, see instructions in the logbook.

Run Recipe and End Use

  1. Select RUN. The screen will change to the process chamber window. Monitor the forward power, DC bias, chamber pressure, and gas flow. Please record into logbook.

  2. When the run is over, stop/vent the chamber (refer to Prep Step 3) to remove the sample.

  3. Once the sample is removed, close the chamber and stop/evacuate the chamber, refer to Prep Step 11.

  4. Run a chamber clean that is appropriate for whichever process you just ran. Use Prep Steps 15-17 as a guideline.

  5. [Note: Always leave under vacuum!]

  6. Log out of the tool by selecting SYSTEM then PASSWORD then VERIFY then OK.

    1. (Can just enter anything into username and press OK, no password needed)

  7. Log out of the tool using the LabAccess terminal.