5 Etching silicon nitride layer

a. Piranha clean if necessary. Otherwise AMI clean.
b. 2 µm thick AZ 1518 Photoresist Recipe – Silicon Nitride Pattern
c. Etcher RIE 790 PlasmaTherm
Recipe: Ta_Nit. Process time: 7 min. Rotate wafer 180 ⁰C. Another etching
process for 7 min.
Notes: If not etched through, add 5 min until silicon layer is visible. Use kapton
tape to secure wafer within chamber.