Loading (from CHA 1)

Have clean samples or clean while venting
- Note: If someone is before you, ask them to leave it vented for your load. Be ready to load when they are done.
Check Xtal life before loading sources and samples
Check Power is off
- IG’s off
- Power sources off
Vent, takes about 12[??] minutes
- Move selector from auto to manual
- Flip vent switch to open and control switch to vent
- Can turn on (pirani) gauge power to see Pirani gauge pressure rise

Go to acid hood, prepare and use surface cleaning solution
- HCL:DI (~1:10)
- Note: Never “approach” acid bench w/out gear on. Can drop in wipes.
- Suit up with inspected apron, mask, and proper sized gloves
- Setup wipes now and put sample in basket
- Pour DI into rinse beaker (400 ml)
- Pour 120 ml DI into 400 ml etch beaker (want a ~1:10 ratio)
- Pour 40 ml HCl into 100ml beaker (HCl is already 1:3 in bottles)
- Pour acid into DI and quadruple rinse 100 ml beaker
- Dip samples for 15 sec in solution (precision is not needed here)
- Cascade rinse for 30 sec in DI
- Blow dry with N2
- Clean beakers and workspace
  - Our acid solution is dilute so you don’t need aspirator
- This part takes about fifteen minutes, so start it once you vent CHA #3
- Carefully take off acid gloves, mask, and apron
- Take samples immediately to CHA #3

Notes: Dep controller tells you thickness. Shutter is manual. Rotation works, simple usage, must rotate for uniformity. If you do copper, everything must be covered beforehand. After Cu, you must take out foil, clean chamber, and replace foil.

Mount clean samples on holders. There is a clip set for the Bank group.
Prep chamber
- Inspect bottom of shutter and hearth
  - Look for scraps on hearth or flaking on shutter bottom
- To clean shutter, double glove, wipe with hand, and vacuum hearth; reglove
- Clean (vacuum) chamber and rim where bell jar seals if needed
To change crystal (located upper left)
- Flip lock, pull xtal out, install new one and lock it.

Notes: If xtal fails, you must reset it by pressing re-verify on controller. Press status on controller to change screen. Johnny suggests doing dep on ‘screen 3’. The one with the re-verify option.

Load samples
Open shutter and load sources

Notes: MER provides some materials: Cu, Cr, Ge, Al.

To change crucible it’s manual, use black plastic knob on right.

Notes: Keep track of crucible position!

Need to input metal and press start on controller to load metal.
- Make sure you can see source using internal mirror (upper right) at realistic viewing position
- Close shutter when done
Clean thermocouple with brush.
Check rotation with samples loaded before you pump down
Clear area around top because it doesn’t go down straight
Pump down, takes about 30 minutes
- Flip vent switch closed, turn knob to auto, flip control switch to auto
- Guide the top down
- Pump down is automatic, don’t leave machine til pump crossover (if it ever does)
- Takes 30-40 minutes.
- Turn on IG (IG2) after crossover, when P < 2e-3/4 T; press filament on left.
Check LN2 level using straw, port is in back
- Add LN2 if needed!
- Acquired in back chase

To scrape top window
- Lower bell jar part of the way
- Unbolt part of window frame. Carefully remove frame and window and seals.
- Do an aluminum acid etch (not demo’d)
- Re-assemble window: put viton seal back in, put in window and second seal, put on frame and bolt.

Evaporation Prep

Notes: The power system is the blue boxes, they are manual.

Dep controller
- - Should be on the main screen
- Press menu, press film
- Input metal number
Wait until chamber gets to < 5e-6 or < 6e-6
Zero the thickness by pressing it on dep con and press status twice to make sure it’s zeroed.
- Will need to press zero, re-verify, zero Ch 1.
- Make sure controller has correct metal.
- Be on proper screen in case of xtal failure [which?]
Turn on rotation
Choose first crucible
Make sure you have enough time on LabAccess before activating power for large stacks
- If your stack needs more than 2 or 3 hours, consider LabAccess time before each run.
Press start twice

Press manual on dep con
Race power up to 30% power
Key should be turned to on.
- Power on light on lefts should come on (faint)
Make sure HV and emission current are zero
Turn on main breaker
- If ion gauge fails, there’s an overcurrent somewhere
Lights should come on, if they don’t, turn off breaker and make sure the breaker is fully assembled

Evaporation

Turn on gun 1 filament, red button middle panel
Turn on high voltage, red button left panel, and turn knob to 7 kV left middle
Turn on emission control (knob at right top) to ~2 (2-2.3).
Look in chamber, make sure metal is heating (lighting up). Wait 30-60 seconds.
Keep an eye on temp and pressure, left of evaporator body.
Top of crucible should glow a little.
Pressure will go up a little (e.g. 5 to 8e-6 T).
Open shutter and checkout crucible and beam aim
- Note: When you can see the ebeam, make sure it is not hitting the hearth or crucible, ever!

Adjust beam to get some raster
- Can only adjust in y, not x (left top)
- Don’t hit your crucible!
Slowly turn up the emission current
Desired power level is determined by you
- From other users, papers, past runs, etc.

It’ll start depositing, so control dep rate!
Watch the dep rate/thickness on main screen or xtal reset screen
Watch the current, it can increase or jump quickly
- in training it went 0 to 30 in 15 seconds of not looking
- At first, keep the dep rate under 0.5 A/s
- Don’t ever exceed 1 A/s, metals can sputter, especially Ge
If xtal or ion gauge goes down, re-verify the xtal on the xtal reset screen.
Close shutter when done
- Ricardo suggests ramping down power/dep rate rate towards the end of your run, to avoid splashing material on shutter (and to get nice, slow layer)
After the dep, ramp down the emission current in ~10 seconds
Ramp down the HV in ~5 seconds
Turn off the current, button under red one.
Turn off HV, button under red one.
Turn off breaker.
Turn down power and press stop.

Switch Source

Switch pocket (source) carefully!
In dep con: press menu, press next film, input metal number, press menu, press start.
See “Evaporation Prep [at proper step]” and “Evaporation”

Finishing (from CHA 1)

When done with emission and HV off
Press reset and zero on the dep controller
Turn off rotation
Turn off power
- Turn off circuit breaker
- Turn off IGs
Press Standby, wait for gate valve, press Vent, takes about 12 minutes
Remove samples and source
Can log off labaccess for pump down if no one is after you
If there is someone after you, you may not have to pump down chamber after use.
To pump down after use
- Push switch to lower and wait for bell to lower and chamber to pump to mT range.
- The pump might start to cross over. That’s when you set the system to standby.
- Change switch to standby
Fill out log

Beam Sweep Notes (from CHA 1)

- Ampl knobs: CW increases
- Freq knobs: CCW increases
- Beam sweeping skill takes some practice.
- The beam when it is centered will be a little circle. If it is too high it will be ovalish. If it is too low it will look like a v thing (upside or sideways maybe).
- It is good to raster a little bit of gold in center of source, but not too small a spot.
- Other metals need rastering over most of surface